Technology

The materials available for the production lines are:

CEM 1 – FR2 – FR3
CEM3
FR4 con TG 135° standard
FR4 con TG 150°
FR4 con TG 170°
FR4 con TG 200°
Poliymide
Roger RF35A; 25N; 25Fr
PTFE – PPO – PPE
FR4 + Kapton
Insulated Metal Substrates (IMS)

Equipment

The plants are all self-sufficient (they do not use subcontractors) for the entirety of their production cycle. They are equipped with the most advanced latest generation machinery with an average changeover of 4.2 years / machine. The capability of the flow chart is calibrated to be used at 80%, to maintain a very high degree of flexibility to satisfy the unplanned requests of its customers. The applied production methodology uses the application of the IATF standards for the automotive industry as a standard, on the entirety of the product created.

Applications

BACK PANELS

PRESS FIT

BLIND AND BURRIED HOLES

MULTIPLE DRILLING SEQUENCES

SEQUENTIAL STACKING

MICRO DRILLING

VERY FINE LINE - VERY FINE PITCH

BGA and MICRO BGA AND LGA

HDI

CERTIFIED CONTROLLED IMPEDANCE

COPPER heat-SINKERS

ALUMINIUM heat-SINKERS

PCB technical specifications

PCB's Specifications


Layers Maximum Board Dimension Maximum Board Thickness Minimum Board Thickness Minimum Core Thickness Base Copper Thickness Aspect Ratio Board thickness tolerance Minimum Diameter Mechanical Hole Minimum Diameter Laser Hole Standard plated hole size tolerance Not Plated Hole tolerance Press-fit hole size tolerance Holes Position Tolerance Minimum Trace Minimum Space Distance Line profile Copper Thickness in the Mech. Hole HDI capability Electrolytic Copper Thickness Sn-Pb Thickness Nickel Thickness on the Connector Gold Thickness on the Connector Tolerance after etching Routing Tolerance V-Cut tolerance V-Cut core tolerance Surface Finishes Solder Mask Types Min solder mask bridge Plug hole diameter Legend Electrical Test (short and open) Impedance tolerance Test Certificate Conformity Certificate Production Date (week and year) Part Number and Issue

Standard

2 - 24
660 x 533
3,2 mm
0,5 mm
0,1 mm
12 – 18 - 35 - 70 – 105 micron
10 : 1
± 10%
0,20 mm
0,10 mm
± 0,076 mm
± 0,051 mm
± 0,050 mm
± 0,076 mm (compared with CAD data)
75 micron
75 micron
0,2mm(CNC) 0,3mm(Punch) 0,5mm(V-Cut)
> 20 micron
3+n+3
> 20 micron
2 ÷ 20 micron
> 4 micron
> 0,8 micron
≤ ± 20%
± 0,13 mm
± 0,130 mm
± 0,100 mm
H.A.L. Lead Free
H.A.L.
Chemical Ni/Au
Chemical Tin
OSP
Hard NI/AU
PISM – Semi Matt – Matt – diff colors
0,10 mm
0,25 mm – 0,50 mm
White + Various colors
100%
± 10 % (impedance < 50Ω ± 5Ω )
On all delivery
On demand
On solder mask
On copper (on demand)
As in the original gerber

High Tecnology

26 - 60
1500 x 610
12,0 mm
0,20 mm
0,05 mm
9 - 140 - 250 - 400 micron
20 : 1
± 8%
0,20 mm
0,075 mm
± 0,076 mm
± 0,051 mm
± 0,050 mm
± 0,076 mm (compared with CAD data)
38 micron
38 micron
=
> 25 micron
To be evaluated
> 25 micron
2 ÷ 20 micron
> 4 micron
> 1,5 micron
≤ ± 20%
± 0,10 mm
± 0,10 mm
± 0,080 mm
H.A.L. Lead Free
H.A.L.
Chemical Ni/Au
Chemical Tin
OSP
Hard NI/AU
PISM – Semi Matt – Matt – diff colors
0,075 mm
0,55 mm – 0,70 mm
White + Various colors
100%
± 5 %
On all delivery
On demand
On solder mask
On copper (on demand)
As in the original gerber