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"ELMAB Technology: Leading the Way in PCB

Manufacturing Innovative Materials for Quality Circuits.

Our offering includes a wide range of advanced materials for printed circuit board (PCB) manufacturing, ensuring solutions suitable for every project’s specific needs: 

  • CEM 1, FR2, FR3: ideal options for simpler circuits.
  • CEM3: a versatile and high-performing alternative.
  • FR4 with TG from 135° to 200°: the preferred choice for applications requiring thermal and mechanical stability.
  • Polyimides and Rogers RF35A, 25N, 25Fr: solutions for high-frequency and high-temperature applications.
  • PTFE, PPO, PPE: advanced materials for specific requirements.
  • FR4 + Kapton and Insulated Metal Substrates (IMS): for excellent heat dissipation and flexibility.

Advanced Production Facilities

ELMAB facilities are equipped with the most advanced technologies with an average machinery renewal cycle of 4/2 years. Every phase of the production cycle, entirely managed internally, adheres to rigorous IATF standards for the automotive industry, ensuring a high level of flexibility to meet even the most unexpected customer demands.

Precision Applications

Our circuits adapt to a wide variety of applications, ensuring customized solutions for every need:

  • Press Fit
  • Blind and Buried Holes, Multi-level Drilling
  • Sequential Stack-up, Microdrilling
  • Extremely Reduced Traces and Insulations
  • BGA, Micro BGA, LGA, and HDI
  • Certified Controlled Impedance
  • Copper and Aluminum Heat Sinks

Technical Specifications of PCBs

The technical specifications for PCBs are numerous, ranging from standard versions (2-24 layers) to high-tech options (26-60 layers), including:

  • Variable Dimensions, Thicknesses, and Tolerances
  • Precision Mechanical and Laser Drilling
  • HDI Capabilities and heavy Copper Thicknesses
  • Advanced Surface Finishes: H.A.L. Lead Free, Chemical Ni/Au, Chemical Tin, OSP, Galvanic Au, ENEPIG…
  • Soldermask and SilkScreen in Various Colors,

100% Electrical Testing, Controlled Impedance Tolerances, and Certifications upon request. Our dedication to innovation and quality enables us to offer products that not only meet but exceed customer expectations in terms of performance and reliability.

PCB's SpecificationsStandard-ipc class2/3High Technology-ipc class3
Layers2 – 2426 – 60
Maximum Board Dimension660 x 5331500 x 610
Maximum Board Thickness3,2 mm12,0 mm
Minimum Board Thickness0,5 mm0,20 mm
Minimum Core Thickness0,1 mm0,03 mm
Base Copper Thickness12 – 18 – 35 – 70 – 105 micron9 – 140 – 250 – 400 micron
Aspect Ratio10 : 120 : 1
Board thickness tolerance± 10%± 8%
Minimum Diameter Mechanical Hole0,20 mm0,20 mm
Minimum Diameter Laser Hole 0,10 mm0,075 mm
Standard plated hole size tolerance± 0,076 mm± 0,076 mm
Not Plated Hole tolerance± 0,051 mm± 0,051 mm
Press-fit hole size tolerance± 0,050 mm± 0,050 mm
Holes Position Tolerance± 0,076 mm (compared with CAD data)± 0,076 mm (compared with CAD data)
Minimum Trace100 micron50 micron
Minimum Space100 micron50 micron
Distance Line profile0,2mm(CNC) 0,3mm(Punch) 0,5mm(V-Cut)=
Copper Thickness in the Mech. Hole> 20 micron> 25 micron
HDI capability3+n+37+n+7
Electrolytic Copper Thickness> 20 micron> 25 micron
Sn-Pb Thickness2 ÷ 40 micron1 ÷ 40 micron
Nickel Thickness on the Connector> 4 micron> 4 micron
Gold Thickness on the Connector0,8 ÷ 1,2 micron0,8 ÷ 1,2 micron
Tolerance after etching≤ ± 20%≤ ± 20%
Routing Tolerance± 0,13 mm± 0,10 mm
V-Cut tolerance± 0,130 mm± 0,10 mm
V-Cut core tolerance± 0,100 mm± 0,080 mm
Surface FinishesH.A.L. Lead FreeH.A.L. Lead Free
H.A.L.H.A.L.
Chemical Ni/Au (ENIG)Chemical Ni/Au (ENIG)
Chemical TinChemical Tin
OSPOSP
Hard NI/AUHard NI/AU
Solder Mask TypesSemi Matt – Matt – diff coloursSemi Matt – Matt – diff colours
Min solder mask bridge0,10 mm0,075 mm
Plug hole diameter0,25 mm – 0,50 mm0,25 mm – 0,50 mm
LegendWhite + Various colorsWhite + Various colors
Electrical Test (short and open)100%100%
Impedance tolerance± 10 %± 5 %
Test CertificateOn all deliveryOn all delivery
Conformity CertificateOn demandOn demand
Production Date (week and year)On solder maskOn solder mask
Part Number and IssueAs in the original gerberAs in the original gerber

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